Unified Logical Effort - A Method for Delay Evaluation and Minimization in Logic Paths With RC Interconnect
نویسندگان
چکیده
A model for delay evaluation and minimization in paths composed of logic gates and RC wires is presented. The method, Unified Logical Effort (ULE), provides closed-form conditions for timing optimization while overcoming the breakdown of standard logical effort (LE) rules in the presence of interconnect. The ULE delay model unifies the problems of gate sizing and repeater insertion: In cases of negligible interconnect, the ULE method converges to standard LE optimization yielding tapered gate sizes. In the case of long wires, the solution converges towards uniform optimal sizing of the gates as in repeater insertion methodologies. The technique is applied to various logic path examples, in order to investigate the influence of wire length, gate type, and technology. Techniques for combining the ULE method with existing heuristics for buffering and repeater insertion are also proposed.
منابع مشابه
Unified Logical Effort—A Method for Delay Evaluation and Minimization in Logic Paths With Interconnect
The unified logical effort (ULE) model for delay evaluation and minimization in paths composed of CMOS logic gates and resistive wires is presented. The method provides conditions for timing optimization while overcoming the limitations of standard logical effort (LE) in the presence of interconnects. The condition for optimal gate sizing in a logic path with long wires is also presented. This ...
متن کاملCorrections to "Unified Logical Effort - A Method for Delay Evaluation and Minimization in Logic Paths With RC Interconnect" [May 10 689-696]
Manuscript received May 21, 2010. Date of publication July 01, 2010; date of current version July 23, 2010. A. Morgenshtein is with Core CAD Technologies Group, Intel Corporation, Haifa 31015, Israel (e-mail: [email protected]). E. G. Friedman is with the Department of Electrical and Computer Engineering, University of Rochester, Rochester, NY 14627 USA (e-mail: [email protected])...
متن کاملComprehensive Evaluation of Crosstalk and Delay Profiles in VLSI Interconnect Structures with Partially Coupled Lines
In this paper, we present a methodology to explore and evaluate the crosstalk noise and the profile of its variations, and the delay of interconnects through investigation of two groups of interconnect structures in nano scale VLSI circuits. The interconnect structures in the first group are considered to be partially coupled identical lines. In this case, by choosing proper values for differen...
متن کاملSkin Effect: A Natural Phenomenon for Minimization of Ground Bounce in VLSI RC Interconnect
As the frequency of operation has attained a range of GHz and signal rise time continues to increase interconnect technology is suffering due to various high frequency effects as well as ground bounce problem. In some recent studies a high frequency effect i.e. skin effect has been modeled and its drawbacks have been discussed. This paper strives to make an impression on the advantage side of m...
متن کاملExplicit Logical Effort Formulation for Minimum Active Area under Delay Constraints
This paper presents a gate sizing method which formulates minimum active area solutions under delay constraints. It is based on the logical effort delay model. Such minimization of transistor widths has direct impact on the power consumption and circuit area reduction. The explicit formulation of the method takes into account the maximum input capacitance, the output load to be driven, and the ...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید
ثبت ناماگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید
ورودعنوان ژورنال:
- IEEE Trans. VLSI Syst.
دوره 18 شماره
صفحات -
تاریخ انتشار 2010